Six Specialty Resin Materials Commonly Used in the Semiconductor Field

August 02, 2024

Preface

In the complex process of semiconductor manufacturing, resin materials play a vital role with their unique properties, providing a strong guarantee for the performance and reliability of semiconductor devices.

I. Epoxy Resin (Epoxy Resin)

Epoxy resin is an extremely widely used resin material in the semiconductor packaging field. It usually has excellent bonding properties, and can firmly combine the chip with the lead frame or substrate to form a reliable connection.

Its electrical insulation is excellent, with volume resistivity often greater than 10^15 Ω-cm, which effectively prevents current leakage and ensures the stable operation of circuits. Mechanical strength is also not bad, tensile strength up to 50 - 100 MPa, can provide good mechanical support and protection for the chip.

Epoxy resin's thermal stability is more prominent, can maintain stable performance within a certain temperature range. Its coefficient of thermal expansion is generally between 20 - 60 ppm/°C. Through careful formulation, the coefficient of thermal expansion can be matched with the chip and other encapsulation materials, thus significantly reducing the adverse effects of thermal stress on device performance.

In practical applications, such as molded packages for integrated circuits (ICs), epoxy resins can form a strong outer shell that effectively shields the chip from external humidity, dust, and mechanical stress. In advanced packaging technologies such as Ball Grid Array Packaging (BGA) and Chip Scale Packaging (CSP), epoxy resins also play a key role in ensuring the integrity and reliability of the packaging structure.

Second, phenolic resin (Phenolic Resin)

Phenolic resin occupies an important position in semiconductor manufacturing, favored for its good heat resistance, corrosion resistance and mechanical strength.

Phenolic resin's long-term use temperature can reach 150 - 200 ° C, can be in a higher temperature environment to maintain the stability of the structure and performance. In terms of mechanical strength, the bending strength can reach 80 - 150 MPa, providing reliable support for semiconductor devices.

In terms of electrical properties, phenolic resin has a certain advantage, dielectric constant is usually between 4 - 6, dielectric loss tangent value of less than 0.05, to meet the requirements of semiconductor devices on the insulation properties.

In the manufacture of multilayer printed circuit boards (PCBs), phenolic resins are often used as interlayer insulating materials to ensure good insulation and stable signal transmission between circuit layers.

In addition, the relatively low cost of phenolic resins is also an important factor in their widespread use in the semiconductor field, especially in some cost-sensitive Semiconductor Products, phenolic resins have become a cost-effective choice.

Third, Polyimide resin (Polyimide Resin)

Polyimide resin is a high-performance material in the semiconductor field, known for its excellent high-temperature resistance, good mechanical properties and excellent electrical insulation properties.

Long-term service temperatures in excess of 250°C enable them to operate stably in extremely high-temperature environments. The tensile strength can reach 150 - 300 MPa, showing a strong mechanical load-bearing capacity. The electrical insulation is even better, with volume resistivity greater than 10^16 Ω-cm, ensuring the safety and stability of circuits.

In advanced semiconductor packaging technologies, such as flip chip packaging and 3D packaging, polyimide resin is often used as a buffer and insulating layer between the chip and the substrate.

It can withstand high temperature reflow processes up to 300°C or more, and with a coefficient of thermal expansion as low as 10 - 20 ppm/°C, it effectively minimizes the effects of thermal stress on the package structure, thus significantly improving package reliability and performance.

Additionally, polyimide resins are used as photoresists in photolithography processes, and with their high resolution (down to the submicron level) and excellent etch resistance, they are able to meet the stringent requirements for fine patterning in semiconductor manufacturing.

IV. Silicone Resin (Silicone Resin)

Silicone resin has a unique position in the semiconductor packaging, especially in response to temperature changes in the performance. Its glass transition temperature as low as -120 ° C, showing excellent low-temperature flexibility, can be in the very low temperature environment to maintain flexibility and performance stability. At the same time, silicone resins have good weathering properties and are resistant to environmental factors over long periods of time.

In terms of electrical insulation properties, silicone resins have a volume resistivity greater than 10^14 Ω-cm, ensuring electrical safety in semiconductor applications.

Their coefficient of thermal expansion, typically around 200 - 300 ppm/°C, is relatively high, but their low stress characteristics (stress less than 1 MPa) give them a unique advantage in chip stress-sensitive packaging structures.

In semiconductor device packaging for automotive electronics and aerospace applications, silicone resins are commonly used in applications where temperature variations are critical, providing reliable protection for the device and ensuring proper operation under extreme temperature conditions.

V. acrylic Resin (Acrylic Resin)

Acrylic resins play an important role in the semiconductor field with their good optical properties, weatherability and adhesive properties.

In terms of optical properties, acrylic resins have excellent light transmittance, usually up to 90% or more, making them ideal for semiconductor lighting (LED) packaging.

Their refractive index is generally between 1.4 and 1.5, which can effectively regulate the propagation and scattering of light and improve the light output efficiency and light uniformity of LEDs.

In addition, acrylic resin has good weather resistance and can maintain stable performance under various environmental conditions. In terms of bonding performance, it can form a strong bond with a variety of materials, providing a reliable connection for the packaging of semiconductor devices.

In some semiconductor sensor package, acrylic resin can be used as a protective coating to effectively protect the sensor from the interference of the external environment, to ensure the accuracy and reliability of the sensor.

Six, polyphenylene ether resin (Polyphenylene Ether Resin)

Polyphenylene ether resin is often used in semiconductor manufacturing for the preparation of high-performance substrate materials, because it has a series of excellent performance.

First of all, Polyphenylene Ether Resin has a very low water absorption rate of less than 0.07%, which allows it to maintain good performance and dimensional stability in a humid environment.

Its high heat resistance is also a major feature, with a long-term use temperature of up to 190°C, which is able to accommodate the heat generated by semiconductor devices during operation.

In terms of electrical properties, the polyphenylene ether resin excels, with a dielectric constant of about 2.5 - 2.8 and a dielectric loss tangent of less than 0.001, providing the chip with a low-loss electrical connection and a stable signal transmission environment.

The good dimensional stability helps ensure the precision and reliability of the substrate, providing a solid foundation for the high-performance operation of semiconductor devices.

Summary

The application of various resin materials in the semiconductor field is distinctive and meets the diverse needs of different segments and application scenarios. With the continuous progress and development of semiconductor technology, the requirements for resin material performance will continue to improve.

Author:

Ms. Tina

E-mail:

sales@honyplastic.com

Phone/WhatsApp:

+86 18680371609