Semiconductor electronics
The production of integrated circuit chips requires highly specialized equipment that can work in multiple harsh environments, such as:
● Plasma in a vacuum environment;
● high temperature;
● contact with highly abrasive liquid;
● Exposure to many highly corrosive chemicals.
Advantage
● Exact reproduction of material available anywhere in the world
● Extensive material selection, engineering support and testing capabilities
● Machining capability, supporting NPI application development of simulation system
● Broadest portfolio of materials designed for wet process tools
● World-leading manufacturer of CMP ring materials, including Techtron® PPS (global standard for CMP applications)
● Materials used in dry process tools such as etch, CVD and ion implantation to reduce cost and improve performance
Common Materials
Acetal
Anti-static , static dissipative , and conductive plastics
CPVC
FEP
Fluoropolymer tubing
FR Polypropylene
ECTFE
PVDF
NYLON
PEEK
PET
PFA
Polyimide tape
PC
Polypropylene
PSU
PPS
PTFE
PEI
Epoxy
Phenolic cotton cloth
Durostone
FR4/G10
Bakelite
Materials Strength
Ø Static dissipative grades
Ø Chemical resistance
Ø Low particle generation in bearing and wear applications
Ø Low outgassing characteristics
Ø Low levels of extractable when placed in high purity chemicals
Ø High temperature capabilities
Ø Dimensional stabilities
Typical Applications
Bearings and bushings
Chemical tanks
Electrical insulators
Flexible tubing
Guards and shields
Polishing rings
Spin chucks
Static control applications
Test sockets
Valve components
Wafer handling parts
Wet benches and work stations
Products and Applications
Product
Application
Techtron®PPS
CMP ring
Semitron®CMP XL20
Etching and CVD reaction chamber
Ketron®1000 PEEK
Wafer transfer
Ertalyte®PET-P
Wet process structure
Duratron®PAI
Wet process components , HP Chemical and Water Storage Container Liners