Comparative analysis of the performance characteristics of
bakelite and epoxy boards
Epoxy board and bakelite board are insulating materials in the more common, bakelite board insulation performance, does not produce static electricity, wear-resistant, high temperature resistance, in the PCB drilling and silicone rubber mah will be widely used, but also metallurgical tools, switchboards, electrical machinery parts of the commonly used materials; and epoxy board it, the most common is the 3240 epoxy board and FR-4 epoxy board, such as halogen-free FR-4 epoxy board has high Mechanical properties and dielectric properties, good heat resistance and and processability, low water absorption is not easy to deformation, the line is different, also determines the application of epoxy boards, halogen-free FR-4 epoxy boards are mainly used in electrical machinery and electrical equipment in the insulating structure of the parts, FPC reinforcing plate, electrical insulation, carbon film boards and so on.
The following is a comparison of the main performance characteristics of bakelite and epoxy boards:
Bakelite board at room temperature with good electrical properties, good mechanical properties, specific gravity 1.45, warpage ≤ 3 ‰, with excellent electrical, mechanical and processing properties. Paper Bakelite is the most common laminate, is also the world's most widely used, the largest number of industrial laminates.
Main characteristics:Good mechanical strength, anti-static, intermediate electrical insulation, is made of insulating impregnated paper impregnated with phenolic resin, baked, hot pressed and become. The product is suitable for use as insulating structural parts in electric motors and electrical equipments which require high mechanical properties, and can be used in transformer oil. With good mechanical strength, it is suitable for pads for drilling in PCB industry, distribution boxes, jig boards, mold cleats, high and low voltage wiring boxes, packaging machines, combs and so on. Suitable for motor, machinery mold, PCB, ICT jig. Molding machine, drilling machine, table grinding pads.
Application characteristics of epoxy board
Various forms. Various resins, curing agents, and modifier systems can be adapted to almost any application that requires a form that can range from very low viscosity to high melting point solids.
Ease of curing. With a variety of curing agents, epoxy resin systems can be cured at temperatures ranging from 0 to 180 degrees Celsius.
Strong adhesion. The presence of inherent polar hydroxyl and ether bonds in the molecular chain of epoxy resins gives them high adhesion to various substances. Epoxy resins have low shrinkage during curing and produce low internal stress, which also contributes to high adhesion strength.
Low shrinkage. The reaction between the epoxy resin and the curing agent used is carried out by a direct addition reaction or a ring-opening polymerization reaction of the epoxy group in the resin molecule, and no water or other volatile by-products are released. They show very low shrinkage (less than 2%) in the curing process compared to unsaturated polyester resins and phenolic resins.
Mechanical Properties. The cured epoxy resin system has excellent mechanical properties.