Back End Test & Related Materials

Back End Test & Related Materials

No segment of Semiconductor plastics have been more impacted from miniaturization than Back End Test. Almost all IC devises must be tested for functionality over a wide range of parameters. In performing the test, a jig is required to fix the IC chip properly for testing. That jig is called a Burn In Socket. Small pins called pogo pins are inserted thru the plastic nest & must touch a precise area of the chip to perform the test. The Burn In Sockets design is determined by the IC Chip it secures, the smaller the chip features, the smaller the hole pattern required

Critical Factors In Selecting Materials for B.E.T applications
Flex Modulus – maintain integrity under load
Tensile Elongation – hole pattern and placement accuracy
Melting Point – burr reduction during machining
CLTE – Maintain dimensions over a temperature range
Moisture Absorption – maintain dimensions when exposed to moisture

Feature Products

Semitron® MDS -100 – Laminated PEEK based super polymer that delivers a high level of machinability, even down to 0.08mm holes, while delivering over 1,400,000 psi flexural modulus, low moisture absorption and low CLTE.

TECAPEEK® LP TV20 – Newest in thin plate technology on the market, this modified PEEK plate is available from 0.4mm thick up to 3.5mm. Its perfect to dial in that thickness for savings while delivering extreme stability and flatness.

Semitron® GC-100 – Injection molded PEEK based polymer system delivering a balance of cost vs performance. With over 1.0 Million flexural modulus and available in 6, 9 and 12mm thickness, GC-100 may be a perfect choice for your challenging application

TECASINT® LP – Polyimide laminate developed to provide a high physical property thin plate material to the Back End Test market. Available in 0.3mm plate up to 3.5mm, this is the perfect solution if your application requires PI but you want to maximize cost.