PEEK or PPS for CMP retaining ring?

PEEK or PPS for CMP retaining ring?

Chemical mechanical polishing (CMP) is a key process technology in the wafer production process, which requires strict process control, strict regulations and high-quality surface shape and plane. demanding.

The CMP fixing ring is used to fix the silicon wafer and wafer during the grinding process. The selected material should have good wear resistance, stable size, chemical corrosion resistance, easy processing, and avoid scratches and pollution on the surface of the wafer/circle. Usually made with standard PPS.

PEEK has high dimensional stability, easy processability, good mechanical properties, good chemical corrosion resistance and good wear resistance. Compared with PPS rings, CMP retaining rings made of PEEK have stronger wear resistance , the service life is doubled, thereby reducing downtime and increasing wafer throughput.

PEEK has wear resistance, low particle generation/high purity and chemical corrosion resistance, which not only meets the stringent requirements of the chemical mechanical polishing process, but also can extend the CMP retaining ring in the chemical mechanical polishing (or wafer polishing) process service life

Therefore, the CMP retaining ring made of PEEK can reduce the downtime caused by replacing the worn CMP retaining ring, thereby reducing the production cost of each wafer and effectively reducing wafer contamination.