What are the semiconductor plastics and their applications

Chip is an important basic component of the information technology industry, now, "lack of core" affects the development of a number of global science and technology industry. Chip manufacturing process is very complex, the mention of semiconductor manufacturing, we tend to focus on silicon wafers, electronic special gas, photomasks, photoresists, targets, chemicals and other materials and related equipment.

In the entire semiconductor process, the role of plastics is mainly packaging and transmission, connecting each process, prevent contamination and damage, optimize pollution control, and improve the yield of key semiconductor processes. Plastic materials used include PP , ABS, PVC , PBT, PC , PPS, fluoroplastics, PEEK, PAI, COP, etc., and with the continuous development of semiconductor technology, the performance requirements for the materials are also increasingly high.

Here's a look at how these plastics are used in semiconductor manufacturing from key semiconductor manufacturing processes, including chemical and mechanical polishing of wafers, wafer cleaning, photolithography, etching, ion implantation, packaging and testing and packaging.

1.Clean room

Semiconductor manufacturing from single crystal silicon wafer manufacturing, to IC manufacturing and packaging, all need to be completed in the clean room, and for the cleanliness of the requirements are very high. Cleanroom panels are generally fire-resistant and not easy to produce electrostatic adsorption of the material is the main. Window materials are also required to be transparent.

Material: anti-static PC, PVC

2.CMP fixing ring

Chemical Mechanical Grinding (CMP) is a key process technology in the wafer production process, CMP fixing ring is used to fix the wafer, wafer in the grinding process, the selected material should have good wear resistance, dimensional stability, chemical corrosion resistance, easy to process, to avoid the surface of the wafer / wafer scratches, pollution.

Material: PPS, PEEK

3.Wafer carrier

Wafer carrier as the name suggests is used to load wafers, there are wafer carrier box, wafer transport box, wafer boat and so on. Wafers stored in the transportation box time in the entire production process accounts for a high proportion of the wafer box itself, the material, quality and clean or not may have a greater or lesser impact on the quality of wafers.
Wafer carriers are generally temperature resistance, excellent mechanical properties, dimensional stability and rugged, anti-static, low gas release, low precipitation, recyclable materials, different processes used in the wafer carriers selected materials are different.

Materials include: PFA, PP, PEEK, PES, PC, PEI, COP, etc., which are generally modified with anti-static properties.

Fluoroplastic, Wafer Basket

Wafer Box, PBT

PES Wafer Boxes

4, crystal boat handle

Crystal boat handle in the semiconductor process, into the chemical acid, alkali etching process, the crystal boat need to rely on the handle to clamp.

Material: PFA

5.FOUP manual opener

Front-opening wafer transfer box (FOUP) manual opener, specifically used to open the front door of the FOUP, in line with the half 300 mm specification of the FOUP can be used. The material is generally conductive engineering plastics.

6.Light mask box

The photomask is a graphic master used in the photolithography process of chip manufacturing, with quartz glass as the substrate and coated with chrome metal mask, using the exposure principle, the light source is projected through the photomask to the silicon wafer can be exposed to show a specific pattern. Any dust or scratches attached to the photomask will cause deterioration in the quality of the projected image, so it is necessary to avoid contamination of the photomask, as well as to avoid particles generated by collision or friction, etc., affecting the cleanliness of the photomask.

In order to avoid fogging, friction or displacement damage to the mask, the mask box is usually made of anti-static, low outgassing and durable materials.

Material: anti-static BAS, anti-static PC, anti-static PEEK, PP, etc.

7.Wafer tools

Tools used to clamp wafers or silicon wafers, such as wafer clamps, vacuum suction pens, etc. When clamping wafers, the materials used will not scratch the surface of the wafer, no residue, to ensure the surface cleanliness of the wafer.

Material: PEEK

8.Chemicals / electronic gas transportation and storage

Semiconductor manufacturing process, such as wafer cleaning, etching, etc. to a large number of electronic gas or chemicals, most of these materials are highly corrosive, so the piping, pumps and valves used for transportation and storage, storage containers and other components or lining materials required to have outstanding chemical corrosion resistance, low precipitation, to ensure that highly corrosive chemicals in the process of chip manufacturing will not contaminate the ultra-clean environment.

Materials: PTFE, PFA, PVDF, ETFE, PEI

9.Gas filtration cartridge

Semiconductor process special gas filtration cartridge is used to remove impurities, improve the purity, so as to protect the yield of chip manufacturing. Generally use high temperature resistance, corrosion resistance, low precipitation materials.

The filter element is made of PTFE, and the skeleton support material is made of high-purity PFA.

10.Bearings, guide rails and other components

Semiconductor processing equipment components such as bearings, guide rails, etc. require continuous operation at low to high temperatures, low wear and low friction, dimensional stability, and excellent plasma erosion resistance and exhaust characteristics.

Material: Polyimide PI

11.Semiconductor package test socket

Test socket is the direct circuit of the semiconductor components electrically connected to the test instrument on the device, different test sockets are used to test the integrated circuit designers specified by a variety of microchips. The materials used for test sockets should meet the requirements of good dimensional stability over a wide temperature range, mechanical strength, low burr formation, durability, and ease of processing.

Material: PEEK, PAI, PI, PEI, PPS

12.Semiconductor Packaging Release Film

ETFE film has heat resistance, chemical resistance, light transmittance, non-adhesion, the surface of the product is clean and pollution-free after release, it is widely used in semiconductor packaging release film.

13.IC tray (IC TRAY)

IC tray is a packaging tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing. IC tray is used as a packaging for chips to protect chips from damage and facilitate automated testing and installation, etc. Therefore, it is required to have materials with low water absorption, temperature resistance, dimensional stability, recyclable, etc.

Material: PPO, PSU, ABS, PP, PEI

Application examples of plastics in the semiconductor can be provided by HONY Plastic please send drawing or inquiry to sales@honyplastic.com