[New material] "Gold" in engineering plastics - polyimide (Polyimide)

November 19, 2022

[New material] "Gold" in engineering plastics - Polyimide (Polyimide)

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Polyimide film (PolyimideFilm) referred to as PI film is a thin film insulation material with good performance. It is made of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) through condensation polymerization It is cast into a film and then imidized.

Features: yellow and transparent, relative density 1.39 ~ 1.45, polyimide film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance, medium resistance, and can be used at -269 ° C ~ 280 ° C It can be used for a long time within the temperature range, and can reach a high temperature of 400°C in a short time. The glass transition temperatures are 280°C (Upilex R), 385°C (Kapton) and above 500°C (Upilex S). The tensile strength is 200MPa at 20°C and greater than 100MPa at 200°C. It is especially suitable as the substrate of flexible printed circuit boards and insulating materials for various high-temperature-resistant motors and electrical appliances.
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Advantages of polyimide

(1) Excellent heat resistance. The decomposition temperature of polyimide generally exceeds 500 ° C, sometimes higher, and it is one of the varieties with high thermal stability among known polymers, mainly because the molecular chain contains a large number of aromatic rings.

(2) Excellent mechanical properties. The tensile strength of the unreinforced matrix material is above 100MPa. The tensile strength of Kapton film prepared with homoanhydride is 170MPa, while biphenyl polyimide (Upilex S) can reach 400MPa. The elastic modulus of polyimide fiber can reach 500MPa, second only to carbon fiber.

(3) Good chemical stability and heat and humidity resistance. Polyimide materials are generally insoluble in solvents, corrosion-resistant, and hydrolysis-resistant. Varieties with different structures can be obtained by changing the molecular design. Some varieties can withstand boiling at 120°C for 500 hours at 2 atmospheres.

(4) Good radiation resistance. The strength of polyimide film remains 86% after 5×109rad dose radiation; some polyimide fibers maintain 90% of their strength after 1×1010rad fast electron radiation.

(5) Good dielectric properties. The dielectric constant is less than 3.5. If fluorine atoms are introduced into the molecular chain, the dielectric constant can be reduced to about 2.5, the dielectric loss is 10, the dielectric strength is 100 to 300kV/mm, and the volume resistance is 1015-17Ω·cm. Therefore, the synthesis of fluorine-containing polyimide materials is a hot research field.
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Author:

Ms. Tina

E-mail:

sales@honyplastic.com

Phone/WhatsApp:

+86 18680371609