FR4 is a glass fiber reinforced epoxy resin composite material with excellent electrical, mechanical and heat resistance properties, which is widely used in electronics, electrical, aerospace and other fields.
The following is the general process of FR4 processing:
1. Design and Planning
Determine the size, thickness, number of layers and other parameters of the FR4 sheet according to the product requirements. Design circuit graphics, including wiring, hole locations, pads, etc. Formulate the machining process plan, including cutting, drilling, etching, plating and other processes.
2. Material preparation
Select suitable FR4 boards and ensure their quality meets the requirements. Prepare the required tools and equipments, such as cutting machine, drilling machine, etching machine, plating equipment, etc. 3.
3. Cutting
Use cutting machine to cut FR4 sheet into required size and shape. Pay attention to the cutting precision and surface quality to avoid burrs, cracks and other defects.
4. Drilling
Use drilling machine to drill holes in FR4 sheets for mounting electronic components and connecting circuits. Control the depth and diameter of the holes to ensure the accuracy of the holes.
5. Etching
Transfer the designed circuit pattern to the FR4 board by photolithography or chemical etching. Etching process should pay attention to control the concentration of etching solution, temperature and time to ensure the quality of etching. 6.
6. Electroplating
Plating on the etched circuit graphics, such as copper plating, nickel plating, gold plating, etc., in order to improve the circuit's conductivity and corrosion resistance. Plating process should pay attention to the control of current density, plating time and thickness of the plating layer. 7.
7. surface treatment
Surface treatment of FR4 boards, such as cleaning, drying, coating solder resist, etc., in order to protect the circuit and improve the welding performance. Surface treatment process should pay attention to control the treatment process and quality, to avoid surface contamination, oxidation and other problems.
8. Assembly and Testing
Mount the electronic components onto the FR4 board, and carry out soldering and connection. Test the assembled circuit boards, such as electrical performance test, reliability test, etc., to ensure that the quality of the product meets the requirements.
9. Packaging and shipping
The tested circuit boards will be packaged, such as anti-static packaging, moisture-proof packaging, etc., to protect the product from damage during transportation and storage.
Notes on shipping according to customer requirements:
1. Pay attention to safety in the processing process to avoid accidents.
2. Strictly control the processing parameters to ensure that the product quality meets the requirements. 3.
3. Pay attention to environmental protection to avoid the pollution of the environment by waste water, waste gas, waste residue, etc. produced in the processing. 4.
4. Carry out regular maintenance and repair of the processing equipment to ensure the normal operation of the equipment. 5. keep records of the processing process.
5. Records and statistics should be made for the processing process, so as to facilitate quality tracing and improvement.
The above is the general process and precautions for FR4 processing, the specific processing technology and process may vary depending on the product requirements and processing equipment. In the actual processing, it is necessary to adjust and optimize according to the specific situation.