Durostone® PCB Solder Pallet Materials

durostone® PCB Solder Pallet Materials

Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT reflow and wave soldering processes, Durostone® CHP760, CAS761 & CAG762.

Durostone PCB soldering tray material High-performance composite material for PCB assembly process
Durostone PCB Solder Tray Material
Durostone material is suitable for all steps in the PCB assembly process, there are 3 grades suitable for surface mount reflow process and wave soldering process

Durostone CHP760 , CAS761 , CAS762
These materials have the following characteristics:

1. Excellent high temperature mechanical properties, suitable for lead-free process
2. Low thermal conductivity
3. Excellent processability, able to manufacture welded trays with complex designs
4. Has good corrosion resistance, that is, for the chemicals involved in modern flux