Performance
1, All-aromatic polyimide analyzed by thermogravimetric analysis, the beginning of its decomposition temperature is generally around 500 ℃. Polyimide synthesized by homophthalic acid dianhydride and p-phenylenediamine, the thermal decomposition temperature of 600 ℃, is so far one of the polymers with the highest thermal stability of the species.
2, Polyimide can withstand extremely low temperatures, such as -269 ℃ in the liquid helium will not be brittle.
3, Polyimide has excellent mechanical properties, unfilled plastic tensile strength are more than 100MPa, homobenzene-type polyimide film (Kapton) for more than 170MPa, thermoplastic polyimide (TPI) impact strength as high as 261kJ/m2. and biphenylene-type polyimide (Upilex S) reaches 400MPa. as engineering plastics. Modulus of elasticity is usually 3-4GPa, the fiber can reach 200GPa, according to theoretical calculations, benzene tetracarboxylic acid dianhydride and p-phenylenediamine synthesized fibers up to 500GPa, second only to carbon fiber.
4, Some varieties of polyimide insoluble in organic solvents, dilute acid stability, general varieties are not very resistant to hydrolysis, this seems to be a disadvantage of the performance of the polyimide is different from other high-performance polymers, a very big feature, that is, alkaline hydrolysis can be used to recover raw materials, such as dianhydride and diamine, such as for the Kapton film, the recovery rate of up to 80% -90%. Change the structure can also get quite resistant to hydrolysis varieties, such as withstand 120 ℃, 500 hours of boiling.
5, Polyimide has a wide solubility spectrum, according to the structure of the different, some varieties are almost insoluble in all organic solvents, and others can be soluble in common solvents, such as tetrahydrofuran, acetone, chloroform and even toluene and methanol.
6, The coefficient of thermal expansion of polyimide in 2 × 10-5-3 × 10-5 / ℃, thermoplastic polyimide 3 × 10-5 / ℃, biphenyl type up to 10-6 / ℃, individual varieties up to 10-7 / ℃.
7, Polyimide has a high resistance to irradiation, its film in 5 × 109rad fast electron irradiation strength retention rate of 90%.
8, Polyimide has good dielectric properties, dielectric constant of 3.4 or so, the introduction of fluorine, or air nanometer size dispersed in polyimide, the dielectric constant can be reduced to about 2.5. Dielectric loss of 10-3, dielectric strength of 100-300kV/mm, volume resistance of 1017Ω-cm. These properties in a wide range of temperatures and frequency range can still be maintained at a high level.
9, Polyimide is a self-extinguishing polymer, low smoke rate.
10, Polyimide in a very high vacuum under very little outgassing.
11, Polyimide non-toxic, can be used to manufacture tableware and medical instruments, and withstand thousands of times sterilization. Some polyimide also has good biocompatibility, for example, in the blood compatibility test for non-hemolytic, in vitro cytotoxicity test for non-toxic.
(1) Parts with low friction coefficient and wear resistance under high speed and high pressure;
(7) Long-term use of temperature exceeding 300 ℃ or more, short-term up to 400 ~ 450 ℃ parts;
(8) High temperature (more than 260 ℃) structural adhesives (modified epoxy resins, modified phenolic resins, modified silicone adhesives and other temperature resistance does not exceed 260 ℃ occasions);
(9) Microelectronic packaging, stress buffer protective coating, multi-layer interconnection structure of the interlayer insulation, dielectric film, chip surface passivation, etc..