TECASINT® 2011 natural UNFILLED POLYIMIDE
Get Latest PricePayment Type: | T/T,Paypal |
Incoterm: | FOB,CFR,CIF,EXW,DDU |
Min. Order: | 1 Kilogram |
Transportation: | Ocean,Land,Air,Express |
Port: | Shenzhen,Guangzhou,Hongkong |
Payment Type: | T/T,Paypal |
Incoterm: | FOB,CFR,CIF,EXW,DDU |
Min. Order: | 1 Kilogram |
Transportation: | Ocean,Land,Air,Express |
Port: | Shenzhen,Guangzhou,Hongkong |
Model No.: TECASINT® 2011 natural UNFILLED POLYIMIDE
Brand: TECASINT
Selling Units | : | Kilogram |
Package Type | : | Export package |
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TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has the maximum strength and elongation, together with a high modulus of elasticity and minimal thermal and electrical conductivity. TECASINT 2011 is highly pure with low outgassing in accordance with ESA regulation ECSS-Q-70-20.
FACTS
Chemical designation
PI (Polyimide)
Colour
brown
Density
1.38 g/cm3
MAIN FEATURES
very good thermal stability
high thermal and mechanical capacity
low outgassing
very good electrical insulation
resistance against high energy radiation
good chemical resistance
high creep resistance
sensitive to hydrolysis in higher thermal range
TARGET INDUSTRIES
mechanical engineering
precision engineering
aircraft and aerospace technology
electrical engineering
cryogenic engineering
medical technology
vacuum technology
electronics
semiconductor technology
Key Properties
Excellent Creep Resistance
Excellent Long-Term Thermal Stability
High Purity Characteristics
High Strength and Stiffness Properties
Only Extremely Low Levels of Extractables And Ionic Impurities
Outstanding Bearing and Wear Properties
Limitations
Chemical Resistance to Some Strong Acids and Bases
Hydrolyzes in Presence of Steam
Applications
Bushings & Bearings
High Purity Semiconductor Applications
Insulating Components for Welding & Brazing Equipment
Pump & Valve Applications
Semiconductor Plasma Applications
Wafer Handling Components
TECASINT 2011 natural UNFILLED POLYIMIDE Technical Data Sheet
VALUE UNIT PARAMETER NORM Notched impact strength (Charpy) 9.3 kJ/m2 max 7.5 J DIN EN ISO 179-1 Impact strength (Charpy) 87.9 kJ/m2 max 7.5 J DIN EN ISO 179-1 Shore hardness 90 Shore D DIN EN ISO 868 Tensile strength 130 MPa DIN EN ISO 527-1 Modulus of elasticity 3600 MPa 1 mm/min DIN EN ISO 527-1 (tensile test) Flexural strength 177 MPa 10 mm/min DIN EN ISO 178 Compression strength 470 MPa EN ISO 604 Ball indentation hardness 260 MPa ISO 2039-1 Elongation at break (tensile test) 8 % 50 mm/min DIN EN ISO 527-1 Modulus of elasticity 3600 MPa 2 mm/min DIN EN ISO 178 (flexural test) Compression modulus 3430 MPa 1 mm/min EN ISO 604 Compressive strain at break 55 % 10 mm/min EN ISO 604 Compression strength 170 MPa EN ISO 604 Glass transition temperature 352 C - Heat distortion temperature 319 C 1.80 MPa DIN 53 461 Specific heat 0.925 J/(g*K) - Thermal conductivity 0.22 W/(k*m) 40°C ISO 8302 Service temperature 290 C long term - Thermal expansion (CLTE) 4.4 - 4.3 10-5*1/K 50-200°C DIN 53 752 Thermal expansion (CLTE) 5.1 10-5*1/K 200-300°C DIN 53 752 surface resistivity 1015 Ω 23°C DIN IEC 60093 volume resistivity 1015 Ω*cm 23°C DIN IEC 60093 Electric strength DC 34.3 kV*mm-1 23°C ISO 60243-1 Dielectric constant 3.5 100 Hz DIN VDE 0303 Dielectric constant 3.5 1 kHz DIN VDE 0303 Dielectric constant 3.4 10 kHz DIN VDE 0303 Dielectric constant 3.4 100 kHz DIN VDE 0303 Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10; Outgassing in high vacuum passed ECSS-Q-70-02 Water absorption 0.47 % 24 h in water, 23℃ DIN EN ISO 62 Water absorption 1.65 % 24 h in water, 80℃ DIN EN ISO 62
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